Engineer, IC Package Design and Integration
Molex
Hsinchu, Hsinchu
2天前

PRIMARY PURPOSE :

IC package OSAT (Oursourced Semiconductor Assembly & Test) partners management

DUTIES & RESPONSIBILITIES :

  • Perform as a project manager to coordinate OE IC NPI activities & qualification in OSAT.
  • Perform as engineering source to survey and qualify new OSAT partners
  • SCOPE :

  • Technical interface with OSAT partners and manage OSAT across NPI (new product introduction) flow to mature IC package sub-assembly and smoothly transfer to production
  • Source and qualify new OSAT partners
  • EDUCATION : REQUIRED :

    REQUIRED :

  • Master or above degree
  • Major in engineering, physics, mechanical or material relative departments
  • WORK EXPERIENCE : REQUIRED :

    REQUIRED :

  • At least 2 years of IC package design or process integration experiences
  • PREFERRED :

  • Familiar with flip chip package, experiences at 3D package, TSV, In-FO or FOWLP is plus
  • IC package failure analysis experiences
  • SKILLS & ABILITIES : REQUIRED :

    REQUIRED :

  • Project management
  • Communication in English
  • Good team player
  • LI-HC1

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