PRIMARY PURPOSE :
IC package OSAT (Oursourced Semiconductor Assembly & Test) partners management
DUTIES & RESPONSIBILITIES :
Perform as a project manager to coordinate OE IC NPI activities & qualification in OSAT.
Perform as engineering source to survey and qualify new OSAT partners
SCOPE :
Technical interface with OSAT partners and manage OSAT across NPI (new product introduction) flow to mature IC package sub-assembly and smoothly transfer to production
Source and qualify new OSAT partners
EDUCATION : REQUIRED :
REQUIRED :
Master or above degree
Major in engineering, physics, mechanical or material relative departments
WORK EXPERIENCE : REQUIRED :
REQUIRED :
At least 2 years of IC package design or process integration experiences
PREFERRED :
Familiar with flip chip package, experiences at 3D package, TSV, In-FO or FOWLP is plus
IC package failure analysis experiences
SKILLS & ABILITIES : REQUIRED :
REQUIRED :
Project management
Communication in English
Good team player
LI-HC1
