Req. ID : 120105
Micron Package Design Engineer
As a Package Design Engineer at Micron Technology, Inc., you will complete substrate and package designs to support New Product Introduction (NPI).
You will be responsible for facilitating package design review meetings with the Taiwan assembly Development, NPI, and MFG teams.
You will provide local support for site specific drawings and substrate vendor approval. You will gather site input to support a technical risk assessment process that occurs during feasibility and design stages.
You will participate in a cross functional DFMEA meeting that reviews and ranks all package risks at design close. You will also work with global design team to make required design rule updates to lower risk levels based on manufacturing data and capabilities.
Primary Responsibilities and Tasks
Create Package Designs
Facilitate package design reviews
Design Coordination and Management
Bachelor Degree or equivalent experience
We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.
This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.
Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy.
The administrator will monitor compliance and is available to answer any questions on EEO matters.
To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).
Keywords : Taichung City Taichung City (TW-TXG) Taiwan (TW) Technology Development Experienced Regular Engineering #LI-RL1