Supply Chain Process Engineer
Taipei, TW
3d ago

Job Description

  • The candidate will be part of Global Outsourcing Department Engineering team in Taiwan, supporting Intel Board and System Outsource team to engage in NPI (New Product Introduction) and manage HVM (High Volume Manufacturing) builds in Intel's Outsource ODMs (Ordinary Design Manufacturer) at Taiwan.
  • The candidate will engage in earlier NPI build for process development to provide technical suggestions and support NPI builds management.
  • In HVM manufacturing phase, the candidate will be the point of contact / escalation for dedicated Products at the outsourcing factory to lead Intel Outsource Factory Manufacturing and engineering-centric continuous improvement projects, excursion management and manufacturing capacity expansion to meet / exceed customer expectations.
  • He / she is expected to early engage in the PLC (Product Life Cycle) at NPI development phase to provide technical suggestions to Intel Process Technology Development (TD) engineer to develop and deploy stable and capable manufacturing solutions in the PLC deployment / NPI phase to ensure HVM Mfg is not a limited to TTM.
  • In this capacity, his / her key business deliverables include but not limited to :
  • Provide technical suggestions to Intel Technology Development (TD) engineer to develop and deploy stable and capable manufacturing solutions from NPI to certify to HVM manufacturing ramp.
  • Early PLC engagement to provide suggestion in DFM (design for manufacturing) to influence, deploys mfg solutions to ensure ODM factory is not a limiter.
  • In HVM phase, candidate will lead factory technical problem solving to resolve mfg and engineering, yield, quality and reliability issues caused by outsource factories.
  • Own driving CQAT( cost, quality, availability and technology); C.I ( continuous improvement); manage change control; drive LEAN programs etc to deliver a world class mfg solutions.


  • Candidate must possess a Bachelor / Master degree in Science or Engineering (Mechanical, Material or Electrical / Electronic discipline) with minimum of 5 year experience in the Boards / Modules Mfg Engineering field.
  • Strong SMT process knowledge with structure problem-solving skills are essential.
  • The candidate will need to drive ODM team to execute HVM deliverables, interface with internal and external customers to resolve technical issues, and provide recovery mitigation plans, thus strong stakeholder management and situational leadership skills are mandatory.
  • The candidate must possess a strong desire to work with system manufacturing assembly lines and help drive continuous process improvement.
  • LEAN, Six Sigma, World Class Manufacturing and other continuous improvement techniques. Candidates with SMT material knowledge and assembly process failure analysis skills are added advantages.

    Other critical soft skills required are :

  • Strong Program Management Skills including the ability to organize, run task teams, and provide concise reports.
  • Good communications skills both written and verbal in English. As candidate needs to interact frequently with ODMs, command of Mandarin both written and verbal is added advantage.
  • Influencing skills, Business Acumen in the board and system products Mfg, Ability to manage ambiguity, Change Management / Adaptability skills, are added advantages.
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