1. Package design and planning of various product.
2. Design & layout of BGA substrate.
3. Co-work with package houses for package design
4. Development of advanced package technology.
5. Package design platform development
Requirement 1. MS or above with major in EE, ME, or related field.
2. Familiar with Cadence APD / SiP and Autocad is a plus
3. Familiar with the design flow of package & BGA substrate is a plus.
4. Familiar with the structures of various packages is a plus : PBGA / TFBGA / FlipChip / POP / PiP / SiP / Module / Fanout.
5. Familiar with Cadence APD skill language is a plus.
6. Familiar with RD layout tool is a plus :
Laker / Virtuoso
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