MtM RD Process Integration & Device Engineers
台灣積體電路製造股份有限公司
竹科
4天前

Description

1.Test-chip design and tape-out system developing

2.Process flow developing

3.New devices developing

4.Collaborate with related teams for Design Collaterals (DRM / DRC / LVS / SPICE / PDK) developing

5.Work location : Hsinchu or Tainan

Qualifications

1.Major in EE or Physics MS or Ph.D

2.Experienced in process integration or HV / BCD devices developing and characterization.

3.Innovative character in problems solving.

4.Familiar with TCAD simulation is a bonus

5.Process integration & CMOS characterization

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