This position is associated with the sale of Intel's NAND memory and storage business to SK Hynix (You can read more about the transaction in the press release - https : / / newsroom.
intel.com / wp-content / uploads / sites / 11 / 2020 / 10 / nand-memory-news-q-a.pdf). The transaction will enhance the resources and potential of the business'
storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.
This position aligns to Phase 1 of the transaction, which includes the 3DNAND enterprise and client SSD business. Phase 1 is expected to close in late 2021, subject to regulatory approvals and other customary conditions.
At deal close, all employees aligned to this phase of the transaction will transition to SK Hynix.
The position will be based in either Shanghai or Taipei. As a Manufacturing Engineer, you will be playing a key role in technical area.
You will be responsible for sustaining the SSD High Volume Manufacturing (HVM) at the ODM, to ensure both the manufacturing processes and the production outputs continuously meet the established quality standard and cost target.
To achieve the goal, you will be working closely with technical partners, including design, test & validation engineers, QRE, NPI manufacturing engineers, global supply chain management teams, as well as ODM suppliers.
Detailed responsibility includes but not limit to :
Early engagement with NPI process development teams to influence DFM (design for manufacturing) and DFA (design for assembly).
Co-ownership of manufacturing recipe characterization with NPI teams, define CTF (Critical-to-Function) process parameters, monitor NPI execution to ensure process capability fully demonstrated before transition to HVM
Based on capacity demand, take ownership for new site or new production line start-up / certification, process & equipment qualification, engineering whitepaper review and approval.
Continuous improvement in production yield, quality and process / module stability, drive cost reduction through lean projects.
Ownership of HVM standard and process change control, chair / drive process change control board (PCCB), ensure sufficient engineering data review and qualification coverage to support the change request approval
Ownership of manufacturing excursion management, chair / drive material review board (MRB), based on technical risk assessment (TRA) and failure analysis (FA) data, pull-in right engineering supporting teams to quickly nail down the root cause, drive risk mitigation plan, corrective action plan, as well as systematical fixes for the issues.
More than 3 years of related industry experience.
Strong technical design review capability
Working knowledge of Design for Manufacturability, throughput analysis, quality control systems, and cost / benefit analysis
Prior experience acting as a liaison between manufacturing sites and product development teams
Ability to work well in a diverse team environment
Experience at coordinating manufacturing operations with outsourced suppliers would be an added advantage
Bachelor of Science or Engineering degree and / or a Master of Science or Engineering degree in Electrical, Electronics, Mechatronics or Computer