Manager, IC Package Integrated Design
Molex
Hsinchu, Hsinchu
6天前

PRIMARY PURPOSE :

In charge of PIC and EIC integrated package design

DUTIES & RESPONSIBILITIES :

1.Survey and watch IC package technology trend to support product roadmap

2.Integrated design manager to lead PIC / EIC integrated package design, validation& qualification

3.Qualify new IC package technology in OSAT

SCOPE :

1.Build up IC package technology / platform via internal and external package capability to support product roadmap

2.Provide design guidelines for key components (e.g. PIC, EIC and etc..) based on IC package technology needs

3.Lead PIC / EIC integrated package design, validation, failure analysis and qualification through coordinating relative expertise

EDUCATION : REQUIRED :

REQUIRED :

  • Master or above degree
  • Major in EE, Electro-optical engineering, Electronics or relative departments
  • WORK EXPERIENCE : REQUIRED :

    REQUIRED :

  • At least 5 years of IC package design or process integration experiences
  • PREFERRED :

  • Familiar with 2.5D package such as application of TSV, TIV and In-FO or FOWLP etc
  • IC failure analysis experiences
  • SKILLS & ABILITIES : REQUIRED :

  • Project management
  • Communication in English
  • Good team player
  • LI-HC1

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