Project Lead Automotive Packaging
NXP Semiconductors

NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer.

As the world leader in secure connectivity solutions for embedded applications, we are driving innovation in the secure connected vehicle, end-

to-end security & privacy and smart connected solutions markets.

Drive and Execute packaging development projects with all its sub projects globally.

  • Responsible for execution : both on time delivery and quality of deliverables
  • Organize team meetings to keep track of progress and report out in different levels of the organization
  • Influence and interact with line managers from Technology and Operations (T&O) : Package Innovation and Manufacturing as well as Product teams to get required allocation of resources for smooth execution
  • Review project progress with key stakeholders, including those at the executive level
  • Actively manage stakeholders, i.e. business lines, NXP T&O, NXP internal and external factories that are on various locations and time zones; US, Europe and Asia
  • NXPis an Equal Opportunity / Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and / or expression, marital status, status as a disabled veteran and / or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law.

    In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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