R&D 3DIC PKG Engineer
台灣積體電路製造股份有限公司
竹科
16小时前
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Description

1.Manage and improve Si / Bumping / Package process

2.Plan and execute defined improvement actions with module

3.Yield improvement and reliability qualify

Qualifications

1.Master degree and above. Major in Material / Electrical / Chemical related fields

2.Over 5-year experience in BEOL / Bump / PKG related fields

3.With good problem solving skills

4.Exhibit good communication skills for cross-functional team-work

5.Fluent in English

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