(Sr) Engineer, Bumping/FC process development
Micron
Taichung, TXQ, TW
1天前
source : SuccessFactors

Micron in Taiwan

Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle.

Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM.

Micron’s Taiwan sites include sales and technical support in Taipei along with state-of-the-art fabrication facilities in Taichung and Taoyuan that together comprise the company’s DRAM Center of Perfection.

The Center’s goal is to achieve the most efficient and effective technology transfer and manufacturing ramp by combining front- and back-end manufacturing, product engineering and technology development roles.

  • Micron’s Advanced Package Technology Development team in Taiwan is looking for a motivated and experienced individual contributor for this position in Process Development team and warpage tuning team.
  • A good candidate will be developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron's memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams.

    Assessing processes by knowledge and skills, taking measurements and interpreting data are every day responsibilities and expectations for the successful candidate.

    Also, material and chemistry engineering preferred and RND experience from OSATs & Substrate manufacturer preferred for warpage tuning engineering purpose.

    Other deliverables in this job function are Assembly design rules development working side by side with Design teams (Globally) and you will be involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board).

    Finally the hands on equipment experience in Pkg Assembly process is needed, to understand the requirements for new equipment to the supplier, may need to conduct the supplier interactions / meetings and drive new NDAs with new projects, which all together requires a significant understanding of the processes, first principles and process control systems.

  • Cu pillar process or FC attach / underfill process
  • Familiar with substrate structure, process, material, design.
  • Familiar with development and process finetune
  • Well know CPI
  • Familiar with DOE skill by JMP or mintab and statistics
  • Education level : PhD and MSc preferred, however, all experienced candidates will be seriously considered
  • According to the "Employment Service Act", positions with salary lower than NTD$40,000, please refer to the salary information in the job description.

    Positions with salary over than NTD$40,000 will be subject to be discussed during interview.

    About Us

    As the leader in creative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information.

    Through our global brands Micron, Crucial and Ballistix we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies : DRAM, NAND, NOR and 3D XPoint™ memory.

    Our solutions are purpose built to use the value of data to unlock financial insights, accelerate scientific breakthroughs and improve communication around the world.

    We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.

    This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

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