As an Engineerin Micron’s Advanced Packaging Technology Developmentgroup at Taiwan Taichung, you will work inindustry-leading semiconductor process technology related to newmemory devices and technologies.
In this position you will developand optimize Chemical Mechanical Planarization (CMP) process neededfor advanced memory stack integration flows.
You will take ideasfrom conception through process development and implementation. Youwill be working alongside with Equipment Engineers, ProcessDevelopment Engineers and Process Integration Engineers to focusand accelerate development of technology that will lead to acommercially successful high densitymemory.
To developnew consumable and evaluate new hardware for Chemical MechanicalPlanarization (CMP)
Todesign, optimize and characterize CMP process needed for successfulintegration
Organize welldesigned experiments to understand the interaction between processand hardware parameters and use this knowledge to optimize for bestperformance
To suggest andevaluate innovative CMP solutions with higher processmargins
To work withvarious integration / structural impacts and constraints to enablefunctional device
Toderive insightful inferences from the analysis of physical andelectrical data and utilize the understanding to modify CMPprocesses to meet the device requirements
Handson experience with CMP polishing equipment whichincludes familiarity with equipment operation, optical metrology,profilometry, common polishing slurries, and polishingpads.
In-depth understanding ofpolishing mechanisms for dielectric and conductiveCMP
Be a critical thinkerand a team player and be able to handle constructive criticism fromother team members and leverage input to drive projectsforward.
Knowledge ofmaterial properties and characterizationtechniques
Possess a highdegree of self-motivation, goal orientation and the ability toaggressively focus on solving problems and to learn newskills
Have the ability toplan and execute well-designed experiments and report resultsconcisely.
Demonstratedependability and willingness to take onresponsibilities.
Expertisein new process / tool technologyassessment
Ability to workon multiple projects and work through cross-disciplinary andcross-organizational logisticalissues.
Strongcommunication and reporting skills both written andverbal.
Strong aptitude for researchand development with interest and capability to create productionworthy technologies
Proactiveapproach to problem / project management and good problem solvingskills
The ability to workindependently under minimal supervision.
Theability to work effectively across different organizations withinMicron.
The ability to effectively organize,prioritize, and manage time andprojects.
Education andExperience :
PhD or MS with previousindustry experience in Chemical Mechanical planarization. Education background in Chemical, Mechanical, Electrical orElectronics Engineering or Material Science or Chemistry or relatedfield of study isacceptable.
We recruit,hire, train, promote, discipline and provide other conditions ofemployment without regard to a person's race, color, religion, sex,age, national origin, disability, sexual orientation, genderidentity and expression, pregnancy, veteran’s status, or otherclassifications protected under law.
This includes providingreasonable accommodation for team members' disabilities orreligious beliefs and practices.
Eachmanager, supervisor and team member is responsible for carrying outthis policy. The EEO Administrator in Human Resources isresponsible for administration of this policy.
The administratorwill monitor compliance and is available to answer any questions onEEO matters.
To request assistance withthe application process, please contact Micron’s Human ResourcesDepartment at 1-800-336-8918 (or208-368-4748).
Keywords : Taichung Taichung City (TW-TXG) Taiwan (TW) Technology Development Experienced FTEB Engineering Not Applicable