SR. ENGINEER, PACKAGE EFA
Micron
Taichung City, TXG, TW
14天前

Job Description

As a 3DIC EFA engineer at Micron Technology, Inc., you will be responsible for the electrical characterization and electrical failure analysis (EFA) of 3DIC product types.

You will use a variety of test tools including the uMate testers, Probers, CAD layout tools, and a variety of technical drawings and schematics to perform detailed characterization.

You will log and sort failures in order to determine particular failure mechanisms characteristics. In this role you will communicate with various engineering groups, assist lab users with equipment setup and interpretation of data, and maintain an EFA database.

You will also be expected to seek ways to improve the EFA process in order to reduce test time, increase throughput, and increase failure mechanism assignment accuracy and consistency.

Responsibilities and Tasks

Analyze Failed Components from Reliability Testing

  • Thorough knowledge of semiconductor component package assembly processes and challenges.
  • Knowledge of 3DIC and challenges
  • Interpret historical tests results
  • Perform visual inspection to identify physical defects
  • Utilize schematics and layouts to recognize abnormalities
  • Document failed conditions and test results
  • Categorize electrical failures
  • Communicate results
  • Coordinate next level analysis to various groups including C-SAM (C-mode scanning acoustic microscope), PYE (Product Yield Enhancement), Product Engineering, Package Reliability, and AQL (Acceptable Quality Level)
  • Identify and communicate new or unusual results (electrical signals)
  • Respond to Equipment Issues

  • Understand test software and hardware configurations
  • Troubleshoot hardware issues
  • Identify and report software and hardware issues
  • Repair or coordinate repair of equipment
  • Configure and upgrade test equipment
  • Develop and deploy failure analysis (FA) software
  • Provide Technical Support and Conduct Training

  • Assist lab users with equipment setup
  • Teach operation of equipment
  • Provide data interpretation
  • Suggest failure root cause
  • Provide suggestions for further analysis
  • Introduce new users to basic DRAM functionality
  • Perform Engineering Requests and Supplemental Tasks

  • Submit package level physical failure analysis (PFA)
  • Provide FA for other groups as requested (RMA, Module)
  • Determine engineering test requirements
  • Execute request and experiments
  • Summarize test results and provide feedback
  • Create repair converters
  • Manage Failure Analysis (FA) Information

  • Create and maintain specific FA database
  • Track FA data
  • Identify false failures
  • Analyze and summarize data
  • Desired

    3+ year experience in each of the following : Semiconductor Manufacturing

    Additional Information :

  • Failure Analysis Troubleshooting
  • Qualifications

  • Strong troubleshooting skill
  • Good organizational skills and sharp attention to detail
  • Good written and oral communication skills
  • Efficient computer skills
  • Knowledge of the DRAM fabrication process
  • Familiarity with Unix, DFII / Cadence, and / or uMate preferred
  • Ability to work independently or in a group environment
  • Basic understanding of electrical equipment
  • Ability to use the analytical tools provided on the various test equipment, such as Micromate, Curve Tracer, or Oscilloscope
  • Education :

  • Minimum of MS or Ph.D in Electrical Engineering or a related field of study.
  • Analysis, or a related field preferred.
  • Closing Date : Until Filled

    Site : MTB - TaiChung City, Taiwan

    We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.

    This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

    Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy.

    The administrator will monitor compliance and is available to answer any questions on EEO matters.

    To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

    Keywords : Taichung City Taichung City (TW-TXG) Taiwan (TW) Technology Development Experienced Regular Engineering Not Applicable

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