Packaging engineer for MEMS packages mass production with focus on consumer products. Engineer is acting as expert interface between OSAT in Asia and team in Germany.
Focus on work in Kaohsiung, frequent visits to Taipei
Oversee / provides guidance to manufacturing technology on quality, yield improvement tasks or technical changes
Work with product engineering teams to accommodate production requirements
Review of vendor line & assembly processes to ensure production stability and following of best practices based on past experience
Identify and record any non-conformities & initiate necessary action to detect and prevent nonconformities.
Team work in English language with a multitude of international interfaces is mandatory
3 - 5 years of professional experience in assembly / packaging of semiconductor components.
Experience with semiconductor assembly related manufacturing is necessary
Experience with MEMS is a plus.
Problem solving skills and fluent English for efficient communication are mandatory.
Work efficiently in international teams.
Willingness to travel (mainly within Asia).
High level of self-motivation and self-initiative