PackageSystem Design Engineer
新竹市, TW
source : jobs4it
  • Location Taiwan - HsinchuJob Overview The IC Package System Design Team at Qualcomm has an opening for Package / System Design Engineer.
  • This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc.

  • Job responsibilities for this position include package selection, package design, and package EE modeling. This involves optimizing system co-
  • design of IC-PKG-PCB die keeping in mind package footprint / height constraints , IC floor-planning , PCB ,high-speed signal integrity , power distribution network and thermal constraints.

    Additional responsibilities :

  • IC top level floorplanning including hard macro block placement, padring, RDL and bump pattern / assignment
  • System level co-design methodology of IC, Package and PCB / Board
  • Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost
  • Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs
  • Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die / pkg / PCB levels
  • Working with marketing / IC / product teams on competitive analysis and road mapping package technology for future productsMinimum Qualifications Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
  • 2+ years Hardware Engineering experience or related work experience.Preferred Qualifications - Experience in IC package and / or PCB selection , design , and layout experience -

    Experience in Pinmap optimization of optimal PCB design - Experience with DDR3 / DDR4 layout process - Experience or knowledge in PCB design process like Schematic capture -

    Experience in IO + PKG + PCB SI / PI modeling, co-simulation and analysis - Strong knowledge in 3D / 2D EM simulation tool, electromagnetic theory and transmission line theory -

    Working knowledge of die floor planning, IO placement, and bump placement - Working knowledge of Chip, Package and PCB co-

    design methodology - Familiar with assembly and substrate manufacturing process - Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.

  • Familiar with PCB stack-up and breakout strategyEducation Requirements Bachelor's Electrical Engineering and / or Mechanical Engineering.
  • Preferred : Master's, Electrical Engineering.
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