Location Taiwan - HsinchuJob Overview The IC Package System Design Team at Qualcomm has an opening for Package / System Design Engineer.
This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc.
Job responsibilities for this position include package selection, package design, and package EE modeling. This involves optimizing system co-
design of IC-PKG-PCB die keeping in mind package footprint / height constraints , IC floor-planning , PCB ,high-speed signal integrity , power distribution network and thermal constraints.
Additional responsibilities :
IC top level floorplanning including hard macro block placement, padring, RDL and bump pattern / assignment
System level co-design methodology of IC, Package and PCB / Board
Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost
Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs
Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die / pkg / PCB levels
Working with marketing / IC / product teams on competitive analysis and road mapping package technology for future productsMinimum Qualifications Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
2+ years Hardware Engineering experience or related work experience.Preferred Qualifications - Experience in IC package and / or PCB selection , design , and layout experience -
Experience in Pinmap optimization of optimal PCB design - Experience with DDR3 / DDR4 layout process - Experience or knowledge in PCB design process like Schematic capture -
Experience in IO + PKG + PCB SI / PI modeling, co-simulation and analysis - Strong knowledge in 3D / 2D EM simulation tool, electromagnetic theory and transmission line theory -
Working knowledge of die floor planning, IO placement, and bump placement - Working knowledge of Chip, Package and PCB co-
design methodology - Familiar with assembly and substrate manufacturing process - Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
Familiar with PCB stack-up and breakout strategyEducation Requirements Bachelor's Electrical Engineering and / or Mechanical Engineering.
Preferred : Master's, Electrical Engineering.