封裝工程師
台灣積體電路製造股份有限公司
竹科
7天前

Description

1. Manage OSAT Bump / WLCSP process integration and yield improvement.

2. Support OSAT bump / WLCSP engineering service for customers.

Qualifications

1. Over 2 years experience in process integration or customer service is preferred.

2. Must be effectively bilingual in Mandarin and English.

3. Related experience in semiconductor front-end integration, process, manufacturing, bumping and WLCSP is preferred.

4. Minimum MS degree majoring in Physics, Chemistry, Materials or Engineering related fields.

申請
申請
郵箱地址
通過點擊“繼續”,我同意neuvo的隱私和條款,並同意接收相關的電子郵件作業提醒。 (隨時取消) 看這裡
持續
申請表格