1. Manage OSAT Bump / WLCSP process integration and yield improvement.
2. Support OSAT bump / WLCSP engineering service for customers.
1. Over 2 years experience in process integration or customer service is preferred.
2. Must be effectively bilingual in Mandarin and English.
3. Related experience in semiconductor front-end integration, process, manufacturing, bumping and WLCSP is preferred.
4. Minimum MS degree majoring in Physics, Chemistry, Materials or Engineering related fields.