Engineer, Design-Signal Integrity
Molex
Danshui District, Taipei City
23小时前

Description

What You Will Do In Your Role

PRIMARY PURPOSE :

  • Provide signal / power integrity support for new and / or existing high speed interconnect solutions, especially for subtrate application.
  • DUTIES & RESPONSIBILITIES :

  • Lead the design and development of the new and / or existing package interconnect technology with in depth experience in package technology, package fab & tape-out / gerber process.
  • Responsible for the package layout design / routing work with the inclusion of the package and routing requirement that meet SI, PI, EMI, and Thermal.
  • Perform 3D modeling and analysis to verify / optmize / fix the SI / PI for new and / or existing package and other interconnect solutions.
  • Develop and implement test vehicles. Perform characterization through the use of high-speed digital testing and electromagnetic modelling techniques.
  • Generate evaluation and qualification reports or presentation materials for both internal and customer use.
  • Provide expert advice to Marketing, Sales and / or customers on package SI / PI related matters.
  • Be up-to-date with industry trend on package technology, high speed connector requirements and disseminate / share information among team members
  • Working with customers on various high-speed serial I / O, Back plane, Board-to-Board and Channel applications
  • Other duties as assigned by the Management
  • SCOPE : This job supports both overseas as well as Taiwan-based employees of Molex.

    The Experience You Will Bring

    Requirements :

    EDUCATION : REQUIRED :

  • Degree in Electrical Engineering or equivalent
  • PREFERRED :

  • Master or bachelor of Engineering (Electrical & Electronics or Bachelor of Science (Physics))
  • WORK EXPERIENCE : REQUIRED :

  • At least 5 years and above of related working experience for a degree holder
  • PREFERRED :

  • Experience in package layout design with in-depth experience in package design and routing / DFM rules, fab& tape-out / gerber process.
  • Experience / knowledge in package technology / architecture is a plus.

  • Experience in SI analysis, 3D modeling and familiar with the package design and routing guideline to meet SI, PI, EMI, and Thermal.
  • Experience with available CAD / CAE tools such as Cadence Allegro Package Designer, Ansoft 3D layout and HFSS, and Agilent ADS & PLTS is a plus.
  • Correlation experience with lab measurements using oscilloscopes, TDRs and VNAs.
  • What Will Put You Ahead

    SKILLS & ABILITIES : REQUIRED :

    REQUIRED :

  • Package Layout and Architectural Design; Signal Integrity / Electromagnetics PREFERRED :
  • Silicon design
  • LI-HC1

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