1. Develop and evaluate the advanced IC Package technology.
2. Collaborate with the assembly subcontractors to complete the technology development.
3. Qualification and yield improvement for the advanced IC Packages.
4. Audit subcontractors.
Requirement 1. MS degree (or above) in Science or Engineering.
2.Familiar with the stress simulation and networking package process
3. Knowledgeable about different kinds of package structures, such as FO, 2.5D package.
Thank you for reporting this job!
Your feedback will help us improve the quality of our services.