Package Development Engineer
Lumentum Operations LLC
New Taipei City, Taiwan

It's fun to work in a company where people truly BELIEVE in what they're doing!

We're committed to bringing passion and customer focus to the business.

If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

Key Responsibilities

  • Work closely with US team and local team on laser package development
  • Execute product design from concept, prototype, characterization, qualification to volume manufacturing
  • Generate BOMs, process flows and engineering reports for new processes and products
  • Works with component vendors for laser modules and tooling / fixtures
  • Work with contract or partner manufacturers to collaborate on new product builds, support NPI of high-volume manufacturing of low-cost optical components
  • Support product qualification tests for new product, processes, or components, support failure analysis
  • Collaborate with equipment and contract manufacturers to develop automated assembly, test & burn in equipment with emphasis on laser diode burn-in & optical testing
  • Collaborate with engineering team to ensure DOE, SPC, and FMEA tools are used regularly throughout product life cycle
  • Communicates / contributes effectively in cross-functional teams (such as manufacturing, quality and supply-chain management)
  • Works closely PLMs and FAEs for product marketing and customer technical support, new product definitions
  • Qualifications :

  • Expertise in opto-electronic and microelectronics package development
  • Experience in conceptual design, vendor interaction, package prototyping, testing, and performance characterization
  • Experience in development and manufacturing of high-volume (>
  • 10M / units per yr), low-cost ( $1 / unit) laser diode or LED packaging, and IC packaging or SiP (system in package) for consumer or automotive applications

  • Familiarity with photonics submount, housing, semiconductor laser diodes, LEDs, photodetectors, driver ICs, and optical components (lenses, diffusers, DOEs).
  • Familiarity with package and component assembly process such as die bonding (solder, epoxies), flip chip assembly, wire bonding, sealing (hermetic and non-hermetic), SMT processes.
  • Experience in working with Contract Manufacturers (CM) and knowledge of assembly / test equipment capabilities (particularly in Asia), experience with automated assembly and test equipment
  • Knowledge of product qualification for consumer and automotive applications
  • Strong written and oral communication skills
  • Education should be MS / PhD in Electrical Engineering or equivalent with 10+ years of experience in optoelectronic, microelectronics or LED components industry
  • Fluent in English & Mandarin (both oral & written)
  • Ability to travel internationally
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