It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.
If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!
Work closely with US team and local team on laser package development
Execute product design from concept, prototype, characterization, qualification to volume manufacturing
Generate BOMs, process flows and engineering reports for new processes and products
Works with component vendors for laser modules and tooling / fixtures
Work with contract or partner manufacturers to collaborate on new product builds, support NPI of high-volume manufacturing of low-
cost optical components
Support product qualification tests for new product, processes, or components, support failure analysis
Collaborate with equipment and contract manufacturers to develop automated assembly, test & burn in equipment with emphasis on laser diode burn-in & optical testing
Collaborate with engineering team to ensure DOE, SPC, and FMEA tools are used regularly throughout product life cycle
Communicates / contributes effectively in cross-functional teams (such as manufacturing, quality and supply-chain management)
Works closely PLMs and FAEs for product marketing and customer technical support, new product definitions
Expertise in opto-electronic and microelectronics package development
Experience in conceptual design, vendor interaction, package prototyping, testing, and performance characterization
Experience in development and manufacturing of high-volume (>
10M / units per yr), low-cost ( $1 / unit) laser diode or LED packaging, and IC packaging or SiP (system in package) for consumer or automotive applications
Familiarity with photonics submount, housing, semiconductor laser diodes, LEDs, photodetectors, driver ICs, and optical components (lenses, diffusers, DOEs).
Familiarity with package and component assembly process such as die bonding (solder, epoxies), flip chip assembly, wire bonding, sealing (hermetic and non-
hermetic), SMT processes.
Experience in working with Contract Manufacturers (CM) and knowledge of assembly / test equipment capabilities (particularly in Asia), experience with automated assembly and test equipment
Knowledge of product qualification for consumer and automotive applications
Strong written and oral communication skills
Education should be MS / PhD in Electrical Engineering or equivalent with 10+ years of experience in optoelectronic, microelectronics or LED components industry
Fluent in English & Mandarin (both oral & written)
Ability to travel internationally