Bumping Engineer
Advanced Micro Devices, Inc
Hsinchu, TW

What you do at AMD changes everything

At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-

performance computing, graphics, and visualization technologies building blocks for gaming, immersive platforms, and the data center.

Developing great technology takes more than talent : it takes amazing people who understand collaboration, respect, and who will go the extra mile to achieve unthinkable results.

It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world.

If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

Job Title : MTS of Bump Engineering (Vendor Management)

  • Job Descriptions
  • Responsible for Bump and Interposer yield, quality, cost and productivity overall improvement, and sustaining activities.
  • Responsible for Bump and Interposer process baseline standardization and continuous improvement.
  • Responsible for Bump-Packaging Interaction activities.
  • Co-work with packaging BU on NPI and Ramp Up readiness at bump and interposer manufacturing site. Proactively communicate task assignments and report status timely to responsible parties.
  • Responsible to manage performance of bump and interposer manufacturing site / supplier regarding yield & quality, out of control lots disposition, and any outliers reporting from internal or external parties.
  • Plan and execute change management from internal or external parties.
  • Drive bump and interposer manufacturer to enhance process, equipment & material capability for future generation / technology products.
  • Assist in additional duties as deemed fit by supervisor.
  • 2. Required skill sets

  • Min 5 years’ experience in Bump or Wafer fab or 2.5D interposer process engineering.
  • Possess FCBGA or 2.5D assembly process knowledge and Chip Packaging Interaction knowledge.
  • Familiar with DOE and JMP.
  • MS degree in Mechanical or Material or Chemical Engineering.
  • Creative, highly motivated self-driven individual team player with the demonstrated ability to independently complete complex engineering tasks on / ahead of time / Lead & Drive for solutions and an aptitude to thrive in a fast-
  • paced multi-tasking environment.

  • Experience is Preparing reports / Presentation and ability to communicate Root cause and Resolution effectively.
  • Good interpersonal communication and presentation skill.
  • Fluent in both spoken and written English.
  • Country : Taiwan State : Taiwan City : Hsinchu

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