Be the technical lead for process technology (such aspower MOSFET, IGBT, super junction, BCD PMIC, ASIC, etc.) alternative sourcing frominternal fab to external foundries to support ON semiconductor’s business needsand capacity flexibility.
Manage new product development needs for business unitusing external foundry technology, including mask tapeouts, inline and EOL dataanalysis, yield improvement and process corners execution.
Manage foundries for process transfer, process module andelectrical performance matching, product yield improvement, process freeze and qualificationin timely manner.
Manage external foundries to meet quality, cycle time,and delivery needs. Set performance goals and manage the results.
Drive design of experiments for process module, deviceperformance, and yield improvement.
Collaborate with internal fabs for benchmark and sharelearning on quality, yield, performance, and systems.
Assist new technology joint development at externalfoundries.
Required / MUST Skillset
Solid understanding of device physics, particularly for discrete power technology.
Special Skillset / Certification
1.Excellent communication skills (including verbal and written) in English to work with foundries, BU, QA, and Operation.
3.Knowledge of wafer-level CSP and packaging, failure analysis skills.