Manager, Package Simulation
Micron
Taichung City, TXG, TW
14小时前

Micron in Taiwan

Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle.

Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM.

Micron’s Taiwan sites include sales and technical support in Taipei along with state-of-the-art fabrication facilities in Taichung and Taoyuan that together comprise the company’s DRAM Center of Perfection.

The Center’s goal is to achieve the most efficient and effective technology transfer and manufacturing ramp by combining front-

and back-end manufacturing, product engineering and technology development roles.

Job Description :

As a Simulation Engineer at Micron Technology, Inc. you will work in the R&D Package design and development group on thermal / mechanical simulations for advanced semiconductor packaging.

In this position, you will be responsible for influencing mechanical and thermal package designs, and furthering the technology of semiconductor packaging.

The scope is to address all mechanical and thermal aspects of packaging technology and associated material and process interactions.

Focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.

Candidate will be responsible for the modeling and characterization of mechanical and thermal response of the IC package using analysis and measurement techniques.

This position will interface with package design, electrical and physical characterization, assembly R&D and other process module teams.

Responsibilities :

  • Provide thermo-mechanical simulation reports to support pathfinding efforts, technology development, and new product introduction
  • Guide test vehicle development to improve simulation correlation to empirical data
  • Provide recommendations to meet product requirements
  • Successful candidates must have :

  • Solid knowledge through academic coursework, or experience required, in thermo-mechanical multi-physics modeling and measurements of IC packaging and related areas.
  • A strong background in mechanical and thermal sciences with emphasis on both analytical and measurement methods.
  • Thorough knowledge of material properties and material property test methods.
  • Working knowledge through academic coursework or experience in numerical simulation of material and
  • structural behavior (non-linear deformation, viscous behavior, etc.).

  • Working knowledge in applying Finite Element Modeling (FEM) and / or Computational Fluid Dynamics (CFD) in related areas;
  • and familiarity with software tools such as ANSYS, Abaqus, FloTHERM, and IcePak.

  • A good understanding of semiconductor packaging processes and materials and technology and trends such as; organic substrate properties, over molding materials and properties, wire-
  • bonding materials and methods, C4 or Cu Pillar attachment methods, etc.

  • Strong oral and written communication skills.
  • Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology
  • Degree required :
  • MS or PhD
  • Academic Discipline(s) :

  • Mechanical Engineering, Materials Engineering, Physics, or related discipline
  • Experience Required :

  • Emphasis on numerical simulations of materials and structures
  • According to the "Employment Service Act", positions with salary lower than NTD$40,000, please refer to the salary information in the job description.

    Positions with salary over than NTD$40,000 will be subject to be discussed during interview.

    We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.

    This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

    Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy.

    The administrator will monitor compliance and is available to answer any questions on EEO matters.

    To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

    Keywords : Taichung City Taichung City (TW-TXG) Taiwan (TW) Technology Development Experienced Regular Engineering Not Applicable

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