DEMQRA Package Lab Engineer
Tiachung City, TXG, TW

Req. ID : 125764

As a Package Lab Engineer in the DRAMand Emerging Memory Quality / Reliability Assurance(DEMQRA) team at Micron Technology Inc.

you will beresponsible for developing, maintaining, andimproving characterization methods and Failure Analysis(FA) for microelectronics packages and PCB Assemblies.

This responsibility includes specifying and improving processes,selecting equipment, and interpretation of test results withrespect to industry standards and Micron requirements.

Insupport of these responsibilities, you will be expected to developand maintain knowledge of leading-edge technology, and may work onprojects that advance the leading-

edge. Additionally, youwill respond to inquiries from internal and external customers forlab activities.

Characterization methods that you maywork on include Board-Level Reliability (e.g. Thermal Cycling,Drop, etc.), Thermal Shadow Moiré warpage measurement, BondIntegrity Testing, Solderability, Moisture Sensitivity, andMechanical (e.g. Bend,Torsion).

Failure Analysis methods that you maywork with include Scanning Acoustic Microscopy (SAM), X-Ray(Including 3D Computed Tomography), SEM, EDS, Cross-

Section,Chemical Decapsulation, and OpticalMicroscopy.

Responsibilities andTasks

Manage Characterization Testingand FailureAnalysis :

  • Define test methodsandprocedures.
  • Analyze testresults.
  • Ensure quality andefficiency of characterization testing and failureanalysis.
  • Develop new FA andcharacterization methods andprocesses.
  • Selectequipment.
  • Drive continuousimprovement.
  • Provide Technical Expertise toInternal / ExternalCustomers

  • Respond to customerrequests in a timelymanner
  • Support audits asneeded
  • Collect, analyze andreport data
  • Collaborate withcustomers to develop custom testmethods
  • Perform customtesting
  • Communicate directlywith customers asneeded
  • Review customerqualificationspecifications
  • Education

    Required : Master’s degree inmechanical / materials Engineering or a related field ofstudy.

    Desired :

    Prefer 1 year experience in any of thefollowing :

  • Mechanical Jobtesting i.e. Bend, Torsion, Shock
  • Electrical Testing orEFA on module or componentlevel.
  • Quality / ReliabilityEngineering
  • FailureAnalysis
  • Materialstesting
  • Required

  • Knowledge of DOEmethods.
  • Strong analyticalproblem-solvingskills.
  • Ability to work wellindependently and inteams.
  • Good written andverbal communicationskills.
  • Desired

  • Knowledge ofmicroelectronics component or module / assembly processes andmaterials.
  • Knowledge ofmicroelectronics failure analysis and characterization methods andindustry standards (e.g. JEDEC,IPC).
  • Understanding ofmechanical and material interaction effects on reliability of ICcomponents and / or Printed Circuit Assemblies (PCB)assemblies.
  • TravelRequired? Yes



    Environment- Office andLab

    Shift- 8+ hour shift, 5 days aweek,


  • ChemicalHandling
  • Personal ProtectiveEquipment


  • Must be able to lift at least20lbs.
  • We recruit, hire, train, promote,discipline and provide other conditions of employment withoutregard to a person's race, color, religion, sex, age, nationalorigin, disability, sexual orientation, gender identity andexpression, pregnancy, veteran’s status, or other classificationsprotected under law.

    This includes providing reasonableaccommodation for team members' disabilities or religious beliefsand practices.

    Each manager, supervisor and teammember is responsible for carrying out this policy. The EEOAdministrator in Human Resources is responsible for administrationof this policy.

    The administrator will monitor compliance and isavailable to answer any questions on EEOmatters.

    Werecruit, hire, train, promote, discipline and provide otherconditions of employment without regard to a person's race, color,religion, sex, age, national origin, disability, sexualorientation, gender identity and expression, pregnancy, veteran’sstatus, or other classifications protected under law.

    Thisincludes providing reasonable accommodation for team members'disabilities or religious beliefs andpractices.

    Each manager,supervisor and team member is responsible for carrying out thispolicy. The EEO Administrator in Human Resources is responsible foradministration of this policy.

    The administrator will monitorcompliance and is available to answer any questions on EEOmatters.

    To requestassistance with the application process, please contact Micron’sHuman Resources Department at 1-800-336-8918 (or 208-368-4748).

    Keywords : Tiachung City Taichung City(TW-TXG) Taiwan(TW) Quality College Regular Engineering NotApplicable Tier3

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