1. Power IC product development
2. CIS product development
3. NVM (MRAM, RRAM) product development
4. MEMS product development
5. 3D-IC development
6. Analog / RF product development
1. MS degree or above in Engineering or Science related (EE, Physics, Material Sciences, ...)
2. Familiar with process / device / product analysis in related fields is preferred.
3. At least 3-yr experiences of related fields.
4. Good communication skills, can converse in both Chinese & English.