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You will be responsible in development of Camera module FOL / EOL process or Camera Module related process such as SMT, Flip chip bonding, Wire bonding, Glass / Holder Attach, Dispensing, Soldering, ACF bonding processes
You will develop new manufacturing process / equipment / material for Camera module related components - You are responsible for developing DOEs, Process specification , D / FMEA and Process control plan -
You have responsibility for Failure analysis, Corrective actions and Yield improvement
Education & Experience
BS / MS in Degree in engineering