Senior/Principal New Package Developing Engineer- ADVANCED PACKAGE DEVELOPMENT
Taichung, TXG, TW
source : SuccessFactors

Req. ID : 144351

Specific Responsibilities :

  • Advanced package technology (2.5D or 3D, FO) research and development
  • Familiar with wafer level & panel level process
  • Familiar with new packing path finding and package design
  • Cu / Cu bond, hybrid bond experience
  • Familiar with material characterization
  • Familiar with JMP data analysis and DOE matrix design
  • Process problem identification and solving
  • Work effectively to produce cross sections cooperation
  • Qualifications :

  • MS or Ph.D. with an engineering major
  • 5 years or above experience in semiconductor process, assembly process, or substrate process technologies is preferred
  • Innovative with independent thinking
  • Good team player with a high motivation
  • Fluent communication in in both English and Chinese
  • We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.

    This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

    Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy.

    The administrator will monitor compliance and is available to answer any questions on EEO matters.

    To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

    Keywords : Taichung Taichung City (TW-TXG) Taiwan (TW) Technology Development Experienced Regular Engineering #LI-CY1

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