Project Engineer
NXP Semiconductors
Kaohsiung
23小时前

Responsibility :

1. Work out in-house package development to fulfill the needs of Business Line based on Application sheet requirement (Package development).

2. Coordinates company technical projects with internal departments (Assembly & testing) for design review, project timeline, characterization requirements, qualification progress and internal / external documentations for package release.

3. Collaborate with PI, Design group, WT, Per-Assy, Assy and FT team for new package / product development and release on integral improvement with cost benefit.,

4. Lead the cross-function teams to reach required quality improvement or cost reduction target.

5. Ensure smooth transition of qualified product / package from qualification phase through high volume manufacturing by upfront effective risk assessment to mitigate potential risk from assembly characterization, risk build and initial production release

Qualification :

1. Master / Bachelor, Mechanical / Chemical / Material / Electrical engineering background.

2. >

3 years of experience in packaging process, e.g. WLCSP / QFN / QFP / BGA...etc

3. Good communication and English skill, include reporting and communication with global coworkers.

4. TOEIC

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