Taichung City, TXG, TW

Req. ID : 131241

作為一名品質操作員 您將協助封裝元件經可靠度測試後的物理性失效分析 分析職責將包括橫截面研磨 X射線檢查 光學顯微鏡檢查 掃描式電子顯微鏡分析等 也將協助完整的可靠度測試作業流程 追蹤物件測試進度 樣品製備等 此外 在各種不同的實驗室中執行封裝材料的特性分析 像如動態機械分析儀 熱機械分析儀 熱重分析儀 晶片強度測試儀以及各種彎曲 / 拉伸 / 壓縮測試儀等工具


  • 協助APTD實驗室工作流程 設定樣品測試程序 追蹤樣測試進度並根據需求與品質工程單位協調工作
  • 使用X射線 光學檢測和電子顯微鏡等工具對封裝元件進行檢測
  • 執行物理性失效分析 例如顯微切片和平面研磨
  • 執行SEM / EDS分析
  • 確保實驗室設備得到維護和校正
  • 準備樣品進行材料特性測試
  • 協助封裝材料特性測試 例如動態機械分析儀 熱機械分析儀 熱重分析儀 推球 / 拉線測試 焊球剪切測試 以及各種用於晶片與元件斷裂分析之機械性測試
  • 條件要求

  • 具有半導體封裝 LCD LED封裝等相關分析測試經驗者
  • 熟悉分析檢驗工具 如X射線與各種光學 / 電子顯微鏡
  • 具有破壞性失效分析方法的經驗 如橫截面研磨 平面研磨等
  • 良好的問題解決和分析能力
  • 良好的溝通能力 具英文溝通能力佳
  • 熟悉工程實驗室環境者佳
  • 所需經驗

  • 至少5年以上相關工作經驗者優先
  • Quality Operator - APTD CharacterizationLab

    As a Quality Operator you will assist inphysical failure analysis and survivor analysis of parts fromreliability testing.

    Analysis duties will includecross-sections, x-ray inspections, optical microscope inspections,SEM inspections, etc. You will also assist in loading reliabilitytest chambers, tracking parts, preparing samples, and performmaterials or part tests on a variety of different lab tools such asTMA, DMA, TGA, die break testers, and various bend / pull / compressiontesters.

    Responsibilities :

  • SupportAPTD lab work flow; loading / unloading chambers, tracking samplesand coordinate work with QE as needed
  • Performnon-destructive inspections of packages with, x-ray, opticalinspection, SEM inspection tools
  • Performphysical failure analysis microsection and planarlapping
  • Perform SEM / EDSanalysis
  • Ensure lab equipment is maintained andcalibrated
  • Prepare samples for materialcharacterization tests
  • Support material &package characterization tests such as TMA, DMA, Wire bond shear,wire bond pull, solder ball pull, solder ball shear, and variousmechanical tests for die break and part breaktesting
  • Successfulcandidates musthave :

  • Some experiencewith testing and analyzing semiconductor packages, LCDs, LEDs,etc.
  • Experience with inspection tools such asx-ray and various microscopes
  • Experience withdestructive failure analysis methods; x-section, planarlapping
  • Good problem solving and analyticalskills
  • Good communication skills (English isnot required, but is a plus)
  • Ability to workcomfortably in an engineering labenvironment
  • Degreerequired : AcademicDiscipline(s) :

    AcademicDiscipline(s) : ExperienceRequired :

    ExperienceRequired :

  • 5 yearsminimum related experience ispreferred
  • Werecruit, hire, train, promote, discipline and provide otherconditions of employment without regard to a person's race, color,religion, sex, age, national origin, disability, sexualorientation, gender identity and expression, pregnancy, veteran’sstatus, or other classifications protected under law.

    Thisincludes providing reasonable accommodation for team members'disabilities or religious beliefs andpractices.

    Each manager, supervisor andteam member is responsible for carrying out this policy. The EEOAdministrator in Human Resources is responsible for administrationof this policy.

    The administrator will monitor compliance and isavailable to answer any questions on EEOmatters.

    To request assistance with theapplication process, please contact Micron’s Human ResourcesDepartment at 1-800-336-8918 (or208-368-4748).

    Keywords : TaichungCity Taichung City (TW-TXG) Taiwan (TW) TechnologyDevelopment Experienced Regular Engineering NotApplicable

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