NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer.
As the world leader in secure connectivity solutions for embedded applications, we are driving innovation in the secure connected vehicle, end-
to-end security & privacy and smart connected solutions markets.
To be the technical owner for their products
To drive and deliver reduction in product manufacturing cost as quickly as possible, including integral yield improvement and cost of non quality (CoNQ) reduction
To work with Business Line for business creation and to deliver a high quality manufacturable product and test solution for meeting or exceeding the required time to market and product cost, as well as business fulfillment
To drive improvement in product quality, e.g. adopt zero defect (ZD) best practice
To drive and continuously improve product manufacturability, including time to yield, R&R improvement, retest recovery rate (RRR) improvement, hold lot prevention, product-process fit, etc.
To support root cause finding on customer return
To support fab / assembly / test center transfers and volume ramp-up
To have RF / Mixed-Signal IC test development or sustaining experience
To be experienced on the Advantest 93000 test platform
To wafer or final test program experience for analog devices on up to 77GHz(mm Wave)is preferable
Having GHz+ probe card and load board debugging and modification experience is preferable
Having RF circuit knowledge such as LNA, VCO, PLL ,Mixer, etc is preferable
NXPis an Equal Opportunity / Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and / or expression, marital status, status as a disabled veteran and / or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law.
In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.