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JR4133 Engineer - Signal Integrity - Taoyuan
The Signal Integrity Research and Development (SI R&D) team supports all of Micron’s current and future product developments.
Major product technologies developed at Micron include DRAM, LPDRAM, RLDRAM, NAND, HBM, HMC, 3DXP, handled NAND and SSDs within the consumer, server, mobile, networking, graphics, automobile and embedded businesses.
The SI R&D works on analysis of end to end systems solutions including but not limited to circuit level, integrated circuit (IC) packages, printed circuit boards (PCBs) and measurements to ensure good Signal Integrity (SI) and power integrity (PI) performance for Micron’s memory solutions.
The team owns all steps of the signal and power integrity support process including die, package and system model generation, product performance analysis, system-level SI evaluation, measurement, correlation, and customer support.
The team also supports future specification development within several industry standards groups including but not limited to JEDEC, ONFI, and IBIS.
The group working environment is technically challenging, team-oriented, collaborative and customer-centric.
As a Senior Signal Integrity Engineer at Micron, you will be responsible for leading the design and analysis of high speed (HS) memory interfaces and power distribution networks (PDN).
You will alternate through different product development teams for a period of time, leading out in SI / PI development to ensure product electrical performance through modeling, simulation, analysis, and correlation of the product at hand.
You will be responsible for representing the SIRD team’s design guidelines for SSD PCB design, including visual review, extraction / simulation, written and verbal feedback to PCB designers and / or system designers
Collaborate and guide external design houses on SSD designs to meet electrical performance requirements
BSEE w / 3 years minimum relevant industry experience
Required courses covering electromagnetic, transmission line and RF theory, analog design or similar fields of study or experience
Required experience and working knowledge of E.M. field solvers (quasi-static and full wave), time and frequency domain simulation tools like Q3D, SIWAVE, HFSS, HSPICE, ADS, etc..
Deep understanding of electromagnetic and transmission line theory, general I / O design, signal integrity, differential and single-ended interface technologies.
Expert in Printed Circuit Board (PCB) layout
Experienced in design and analysis of high-speed single-ended or differential buses
Familiarity and fundamental understanding of lab measurement equipment like Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc.
Ambitious candidate should enjoy leading and taking ownership of assigned projects, exhibit good written and verbal interpersonal skills, fluency in English and Mandarin and have the ability to work well in a team with varied strengths.