Integration lead for the development, release and transfer of process options at external foundries.
Close collaboration with process development teams in external wafer manufacturing fabs, NXP technology groups, the business lines and various other stakeholders
Lead and steer the projects towards timely completion to support NXP business needs
Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project;
not limiting to technical judgement, resource planning, project schedule, logistics.
Bachelor or MSc in physics or electrical engineering.
In-depth knowledge of IC devices and processes.
10 years of experience with front-end IC process integration, process development or process transfer projects.
Hands on experience in being a project lead; leading project teams with responsibilities in development or transfer projects from start to completion
All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project / integration lead.
Good communication skills.
Pro-active working attitude, creative, pragmatic, enterprising and result driven.
Having the ability to influence and steer a discussion
Familiar in managing / working with foundries, maximising leverage from foundries
Experienced with RF technologies will be a plus