IFS Package Assembly Test Ecosystem Enabling
Taipei, TW

Job Description

About the Group : As an integral part of Intel's new IDM2.0 strategy, we are establishing Intel Foundry Services (IFS), a fully vertical, standalone foundry business, reporting directly to the CEO.

IFS will be a world-class foundry business and major provider of US and European-based capacity to serve customers globally.

Intel Foundry Services will be differentiated from other Foundry offerings with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe - available for customers globally - and a world-class IP portfolio that customers can choose from including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP.

IFS will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages.

This business unit is completely dedicated to the success of its customers with full P and L responsibilities. This model will ensure that our foundry customers' products will receive our utmost focus in terms of service, technology enablement and capacity commitments.

IFS is already engaged with customers today starting with our existing foundry offerings and we are expanding imminently to include our most advanced technologies, which are optimized for cutting-edge performance, making them ideal for high-performance applications.

The responsibilities of IFS Package Assembly Test (PAT) Ecosystem Enabling include the following

  • Creation of Package Assembly Test ecosystem alliance including OSAT, 3rd party design house, assembly integrators, strategic component suppliers (substrates, passives, etc.
  • test integrators, ODM, etc.,) Supply Chain assurance to meet customer demands

  • Conduct competitive analysis on IFS customer products
  • Develop business intelligence regarding future trends in PAT ecosystem
  • Participate in supplier Technical Road Map (TRM) meetings and understand future capabilities and investments.
  • Influence IFS PAT investment decisions to add more strategic value to our customers
  • Facilitate iCAP investments to promote technologies that adds future value to Intel's PAT portfolio
  • Participate / Drive standards forum and consortia to promote standardization and leverage industry resources for pre competitive technology enabling.
  • Develop collaboration models between IFS and PAT ecosystem.
  • Facilitate NDAs, cost / capacity negotiations, NRE, Should cost model development
  • Ensure environmental compliance of Intel PAT solutions.
  • Ensure technology and manufacturing ecosystem readiness at OSAT and other partners to meet IFS Packaging roadmap
  • Qualifications

    Minimum Qualifications :

  • 15+ years of technical leadership experience in semiconductor packaging industry.
  • Degree in Engineering discipline (Mechanical, Materials, Electrical, Mechanics, Chemical, etc.,) or equivalent
  • Preferred Qualifications :

  • Hands on experience in global packaging ecosystem including OSAT, substrates, assembly materials, test integrators, design integrators etc.,
  • Strong business acumen in PAT Ecosystem
  • Expertise in leading programs involving large number of multi-disciplinary internal and external stakeholders / partners / customer
  • MBA and / or Advanced engineering degrees preferred
  • Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork / classes / research.
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