Package engineer
MediaTek
HsinChu
6天前

Job Description

  • Develop and evaluate the advanced IC Package technology.
  • Collaborate with the assembly subcontractors to complete the technology development.
  • Qualification and yield improvement for the advanced IC Packages.
  • Audit subcontractors.
  • Requirement

  • BS degree (or above) in Science or Engineering.
  • and familiar with the stress simulation or substrate process or wire bond / flip chip processes.
  • Knowledgeable about different kinds of package structures, such as PBGA / TFBGA / FlipChip / POP / PiP / SiP / Modul
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