Req. ID : 126644
As an ENGINEER, PACKAGECHARACTERIZATION you will help develop new characterizationmethods, and advise teams on test structure and test vehicledesigns to support materials, process, and product developmentefforts.
You will be intimately familiar with surface mounttechnology materials and material interactions, qualification andboard level reliability assessment methods, and be able to provideplans to assess reliability margin of new concepts and new failuremechanisms.
Close collaborationwith package and systemdesign, CPI, simulation, QA, process integration, processengineering, product engineering, NPI / BU, and backend central teamisrequired.
Successful candidates musthave :
Werecruit, hire, train, promote, discipline and provide otherconditions of employment without regard to a person's race, color,religion, sex, age, national origin, disability, sexualorientation, gender identity and expression, pregnancy, veteran’sstatus, or other classifications protected under law.
Thisincludes providing reasonable accommodation for team members'disabilities or religious beliefs andpractices.
Each manager, supervisor andteam member is responsible for carrying out this policy. The EEOAdministrator in Human Resources is responsible for administrationof this policy.
The administrator will monitor compliance and isavailable to answer any questions on EEOmatters.
To request assistance with theapplication process, please contact Micron’s Human ResourcesDepartment at 1-800-336-8918 (or208-368-4748).
Keywords : Taichung Taichung City (TW-TXG) Taiwan (TW) Backend Manufacturing Experienced Regular Engineering Not Applicable