Taichung, TXG, TW
source : Successfactors

Req. ID : 126644

As an ENGINEER, PACKAGECHARACTERIZATION you will help develop new characterizationmethods, and advise teams on test structure and test vehicledesigns to support materials, process, and product developmentefforts.

You will be intimately familiar with surface mounttechnology materials and material interactions, qualification andboard level reliability assessment methods, and be able to provideplans to assess reliability margin of new concepts and new failuremechanisms.

Close collaborationwith package and systemdesign, CPI, simulation, QA, process integration, processengineering, product engineering, NPI / BU, and backend central teamisrequired.

Responsibilities :

  • Provideend-to-end technical risk assessments (Si to system) andreliability characterization plans for second level interconnectmaterials, accounting for assembly / PWF process, device, &package design interactions
  • Develop testvehicles as needed to support pathfinding, process development, andpackage development efforts related to board levelreliability
  • Drive efforts to establish boardlevel package design rules coordinating with SimulationEngineering, Package Design Engineering, and Module / SSD DesignEngineering
  • Document BKM material combinationsfor BLR design rules, and roadmaps that provide end-to-enddirection from development and subsequent transfer toHVM
  • Successful candidates musthave :

  • Extensiveknowledge of surface mount technology and material systems,including solder alloys and PCB surface finishes, and quality &reliability test methods to evaluatesame
  • Experience in reliability statistics,acceleration modeling, and experimental methods used to deriveconstants for degradation mechanisms
  • Experiencewith surface mount materials & process interactions related tosystem level failure modes
  • Understanding ofmethods used for electrical failure analysis, physical failureanalysis, thermomechanical system analysis, and metallurgicalsystems analysis
  • Strong data analysis and DOEskills
  • Knowledge ofFMEA
  • Excellent problem solving and analyticalskills
  • Strong communication skills (verbal andwritten)
  • Degreerequired :

  • BSrequired, MS or betterpreferred
  • AcademicDiscipline(s) :

  • MaterialsEngineering, Material Science Engineering, Mechanical Engineeringor a related discipline ispreferred
  • ExperienceRequired :

    Werecruit, hire, train, promote, discipline and provide otherconditions of employment without regard to a person's race, color,religion, sex, age, national origin, disability, sexualorientation, gender identity and expression, pregnancy, veteran’sstatus, or other classifications protected under law.

    Thisincludes providing reasonable accommodation for team members'disabilities or religious beliefs andpractices.

    Each manager, supervisor andteam member is responsible for carrying out this policy. The EEOAdministrator in Human Resources is responsible for administrationof this policy.

    The administrator will monitor compliance and isavailable to answer any questions on EEOmatters.

    To request assistance with theapplication process, please contact Micron’s Human ResourcesDepartment at 1-800-336-8918 (or208-368-4748).

    Keywords : Taichung Taichung City (TW-TXG) Taiwan (TW) Backend Manufacturing Experienced Regular Engineering Not Applicable

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