2022 Internship Program - Pre-Assembly Process Engineering
NXP Semiconductors

Project objective :

1. Collaborate with process engineer for FDC (Fault Detection & Classification) data analysis model development. 2.Collaborate with production staff to set up a good bridge with foreign labor for process controlling methodology explanation and deployment.

Prerequisite knowledge :

1. Major in engineering field is preferred. 2. Good English capability in writing, reading and communication (TOEIC >

600 is better). 3. Smart and logistic thinking, work independently with passion, eager to drive for improvement. 4. Familiar with MS office tools.

Expected Learning & Achievement :

1. Learning for pre-assembly & Chip Sort product engineering process knowledge establishment. 2. Develop semiconductor process controlling mindset through on-job training and assignment.

3. Communication capability development by driving improvement project activity and building a good bridge with foreign labor.

4. Opportunity to approach FDC core knowledge and real practice in the industry.


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