Sr. Process Engineer
NXP Semiconductors
Kaohsiung
12小时前

Position Summary

Pre-assembly (wafer grinding & sawing) process engineer

Possesses experience in pre-assembly >

5years with also group management experience (include wafer grinding / wafer sawing / wafer grooving / wafer marking..etc)

Job Description

  • To strengthen pre-assembly process technical competency by RCPS and FMEA deployment.
  • Coordinate and drive for annual cost saving opportunity initiation and realization.
  • Deep dive in driving the standardization on both process and equipment through documentation and methodology.
  • Set up solid process control methodology through SPC control, machine log analysis and FDC implementation.
  • Lead the improvement subject requested by BL to secure NXP core business performance.
  • Integrate process team resource to solve daily process issues to secure production delivery in time and ATKH KPI performance.
  • Collaborate with global process UG team to conduct the improvement and share the learnings with UG.
  • Customer quality complain handling, report and communication with BL.
  • NPI / NTI risk assessment with project leader & innovation and lead the improvement to approach the 1st time right NPI achievement with peers.
  • Qualifications

  • Master degree above is preferred
  • 5 years’ relevant working experience as process engineer.
  • Good written and verbal communication skills in English.
  • Good integration ability for reporting and communication with management.
  • Ability to coordinate projects and work with multiple teams.
  • Available to work after hours and weekends when required.
  • Work knowledge in FMEA,SPC,7QC tools, OCAP, PDCA, Problem solving, 6 sigma and 8D approach.
  • Critical thinking skill and own the advanced WLCSP experience.
  • Calm under pressure must be able to troubleshoot at an advanced level and come up with effective working solutions quickly
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