Execute internal cross-site capability review, to initiate capability gap analysis with cooperating the eng. depts of site by product spec and customer requirement.
To coordinate internal resource to finish the package and technology roadmap based on the gap analysis.
To be the turnkey of process integration for internal capability to provide the packaging solution of new product.
To manage and prioritize the development master plan of roadmap to confirm the capability build up on time delivery by site.
To monitor and coordinate the process development of project to execute project management.
To monitor the production index of project and follow up the improvement action for smooth production.
At lease 8 years of experience in Cu pillar Flip Chip of assembly process.
Familiar with Handle GDDR memory.
Need to do business travel.
Bachelor and above, major in Engineering and Material Science relevant degree.
Excellent interpersonal and communication skills both in English and Mandarin Chinese.
Please feel free to send your updated CV and contact info to Eric Chou if you're interested in this role, thank you.