What you'll be doing
The primary responsibilities are to support critical Failure Analysis activities of NVIDIA devices in Taiwan, by performing the analysis using available tools in-house and / or facilitating outside lab usage to get the analysis done, and communicating FA findings effectively to provide timely assistance in root-causing the problems.
Have the opportunity to employ advanced backside analysis techniques and use state of the art analytical instruments including : Curve Tracer, ATE, CAD navigation tools, 3D X-ray system, Emission based systems (EMMI, LIT) for silicon and package analysis as well as Optical and Laser scanning based systems (Static Laser Stimulation / Dynamic Laser Stimulation SLS / DLS , Laser Voltage Imaging and Probing LVI+LVP ) to extract internal electrical signals to debug and trace down problems.
Work with PFA team on SEM (Scanning electron microscope) to look at the sub-micron metal layers and silicon transistor devices.
Additional responsibilities may include communications with foundry and assembly partners and product-engineering related activities.
The position requires a technology related bachelor's degree plus ten years of related experience or equivalent combination of training and experience.
What we need to see :
10 plus years of experience is required.
BS degree (or equivalent experience) in electronics or related engineering fields to facilitate the FA workflow established by FA lab at SC HQ.
Laser Scanning Microscopy (LSM) based analytical tools (OBIRCH, LIVA / TIVA, SDL / LADA, LVx, etc.).
Good written and verbal communication skills.
Ability to participate on dynamic teams are required.
Knowledge in at least two of the following areas : basic electrical engineering and testing / automated test equipment (ATE) / transistor device physics / silicon device physical failure analysis / advanced CMOS manufacturing / processes / circuit analysis.
Ways to stand out from the crowd :
Ability to understand and / or operate Physical Failure Analysis tools for Silicon inspection / cross-section / delayering / material analysis (Scanning Electron Microscope SEM , Focused Ion Beam FIB , Nanoprobing, etc.) is a plus.