Process Development/ Transfer Integration Lead
NXP Semiconductors

Responsibility :

  • Integration lead for the development, release and transfer of process options at external foundries.
  • Close collaboration with process development teams in external wafer manufacturing fabs, NXP technology groups, the business lines and various other stakeholders
  • Lead and steer the projects towards timely completion to support NXP business needs
  • Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project;
  • not limiting to technical judgement, resource planning, project schedule, logistics.

    Qualifications :

  • Bachelor or MSc in physics or electrical engineering.
  • In-depth knowledge of IC devices and processes.
  • 10 years of experience with front-end IC process integration, process development or process transfer projects.
  • Hands on experience in being a project lead; leading project teams with responsibilities in development or transfer projects from start to completion
  • All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project / integration lead.
  • Good communication skills.
  • Pro-active working attitude, creative, pragmatic, enterprising and result driven.
  • Having the ability to influence and steer a discussion
  • Familiar in managing / working with foundries, maximising leverage from foundries
  • Experienced with RF technologies will be a plus
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