Req. ID : 125078
As a Package Silicon Integration Manager in Micron's Advanced Packaging Technology Development Group, you will be responsible for driving leading edge IC package development.
You will collaborate with various functional teams such as silicon design, package design, wafer fab, package integration, test and QRA to formulate and execute the characterization and qualification plan.
Demonstration of the technology is shown through meeting the requirements for thermal, mechanical, electrical, reliability and customer specifications.
You will drive the technology development through multiple phases of maturity and contribute to Micron's strategic objectives of Technology leadership.
Key Responsibilities :
Identify technology, quality and business process gaps and develop and deploy needed solutions.
We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.
This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.
Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy.
The administrator will monitor compliance and is available to answer any questions on EEO matters.
To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).
Keywords : Taichung Taichung (TW-TXQ) Taiwan (TW) Technology Development Experienced Regular Engineering Not Applicable