Lead NPI engineering in assembly process (Bumping, QFN, FC, BGA, CSP, WLP)
Manage OSATs and Semtech strategy partners to establish high quality assembly manufacturing process
Manage technology transfer, develop bumping / advance packaging process based capability & capacity system from new product to manufacturing.
Manage operational execution focusing on assembly / bumping / WLCSP process
Support CCB, APQP and PCN review while working with cross functional teams to execute changes
Work with OSATs to continuously improve yield & quality by executing engineering innovation
Work with multiple teams across different countries / time zones and deliver engineering priorities
Fluent Spoken and Written English.
Ability to travel when / if needed
M.S. or B.S. in Mechanical, Electrical, Electronics, Chemical, Materials Engineering or Sciences related to the semiconductor industry
At least 5 years of relevant work experience in IC Assembly, Bumping, Fab or Assembly process engineering
Familiar with flip chip, molded csp, fan out, wafer level packaging is an advantage
Career Growth Philosophy :
At Semtech, we seek innovation and leadership from each and every member of our team. Our goal is to ensure that our talented professionals are equipped with support, resources, and the opportunity to excel.
Our pay-for-performance philosophy provides recognition and prestige coupled with a competitive compensation package.