Package Development Engineer
Lumentum Operations LLC
New Taipei City, Taiwan

It's fun to work in a company where people truly BELIEVE in what they're doing!

We're committed to bringing passion and customer focus to the business.

If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!

Key Responsibilities

  • Work closely with US team and local team on laser package development for consumer and automotive applications
  • Execute product design from concept, prototype, characterization, qualification to volume manufacturing
  • Work with contract or partner manufacturers to collaborate on new product builds, support NPI of high-volume manufacturing of low-cost optical components
  • Drive product reliability test plan and execution, data analysis, report, and failure analysis for new product, process, or component qualification.
  • Collaborate with engineering team to ensure DOE, SPC, and FMEA tools are used regularly throughout product life cycle
  • Communicates / contributes effectively in cross-functional teams (such as manufacturing, quality and supply-chain management)
  • Works closely PLMs and FAEs for product marketing and customer technical support, new product definitions
  • Qualifications :

  • Experience in optoelectronic and microelectronics package development from conceptual design, vendor interaction, package prototyping, testing, and performance characterization to NPI / volume production.
  • Knowledge of product reliability / qualification standards for consumer and automotive applications, experience in product qualification reliability tests
  • Experience in development and manufacturing of high-volume (>
  • 10M / units per yr), low-cost ( $1 / unit) laser diode or LED packaging, and IC packaging or SiP (system in package) for consumer or automotive applications is preferred

  • Familiarity with photonics submount, housing, semiconductor laser diodes, LEDs, photodetectors, driver ICs, and optical components (lenses, diffusers, DOEs).
  • Familiarity with package and component assembly process such as die bonding (solder, epoxies), flip chip assembly, wire bonding, sealing (hermetic and non-hermetic), SMT processes.
  • Experience in working with Contract Manufacturers (CM) and knowledge of assembly / test equipment capabilities (particularly in Asia), experience with automated assembly and test equipment
  • Strong written and oral communication skills
  • MS / PhD in optoelectronic or related areas with 5+ years of experience in optoelectronic, microelectronic packaging or LED components industry
  • Fluent in English & Mandarin (both oral & written)
  • Ability to travel internationally
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