Senior Failure Analysis
NXP Semiconductors
Kaohsiung
4天前

Responsibility :

  • Responsible for failure analysis package and die level for customer return, new product qualification, and low yield.
  • Perform electrical failure analysis using techniques such as PEM / OBIRCH / SDL / LADA using EVB or D10 tester.
  • Perform physical failure analysis using techniques such as SEM / EDX / FIB / TEM.
  • Perform wet, dry, and chemical package preparation process.
  • Document new failure analysis operating procedures, training, and certification.
  • Participate in new failure analysis techniques development and evaluation of new techniques.
  • Qualifications

  • Experience in semiconductors is a plus.
  • At least 5 years working experience.
  • English Reading & Writing
  • Good at communication with others
  • Can work under pressure
  • M.S. in EE background is a Plus
  • Knowledge of electrical failure analysis is a Plus
  • Medium level or Fluent in speaking English
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