DEMQRA Package Lab Engineer
Tiachung City, TXG, TW

Req. ID : 125764

As a Package Lab Engineer in the DRAM and Emerging Memory Quality / Reliability Assurance (DEMQRA) team at Micron Technology Inc.

you will be responsible for developing, maintaining, and improving characterization methods and Failure Analysis (FA) for microelectronics packages and PCB Assemblies.

This responsibility includes specifying and improving processes, selecting equipment, and interpretation of test results with respect to industry standards and Micron requirements.

In support of these responsibilities, you will be expected to develop and maintain knowledge of leading-edge technology, and may work on projects that advance the leading-

edge. Additionally, you will respond to inquiries from internal and external customers for lab activities.

Characterization methods that you may work on include Board-Level Reliability (e.g. Thermal Cycling, Drop, etc.), Thermal Shadow Moiré warpage measurement, Bond Integrity Testing, Solderability, Moisture Sensitivity, and Mechanical (e.g. Bend, Torsion).

Failure Analysis methods that you may work with include Scanning Acoustic Microscopy (SAM), X-Ray (Including 3D Computed Tomography), SEM, EDS, Cross-

Section, Chemical Decapsulation, and Optical Microscopy.

Responsibilities and Tasks

Manage Characterization Testing and Failure Analysis :

  • Define test methods and procedures.
  • Analyze test results.
  • Ensure quality and efficiency of characterization testing and failure analysis.
  • Develop new FA and characterization methods and processes.
  • Select equipment.
  • Drive continuous improvement.
  • Provide Technical Expertise to Internal / External Customers

  • Respond to customer requests in a timely manner
  • Support audits as needed
  • Collect, analyze and report data
  • Collaborate with customers to develop custom test methods
  • Perform custom testing
  • Communicate directly with customers as needed
  • Review customer qualification specifications
  • Education

    Required : Bachelors Degree in Engineering or a related field of study.

    Desired :

    1 year experience in any of the following :

  • Micro Electronic Packaging
  • Quality / Reliability Engineering
  • Failure Analysis
  • Materials testing
  • Required

  • Knowledge of DOE methods.
  • Strong analytical problem solving skills.
  • Ability to work well independently and in teams.
  • Good written and verbal communication skills.
  • Desired

  • Knowledge of microelectronics component or module / assembly processes and materials.
  • Knowledge of microelectronics failure analysis and characterization methods and industry standards (e.g. JEDEC, IPC).
  • Understanding of mechanical and material interaction effects on reliability of IC components and / or Printed Circuit Assemblies (PCB) assemblies.
  • Travel Required? Yes

    Travel Frequency-Not Specified

    Travel Duration-2 weeks

    Travel Type-International

    Environment- Office and Lab

    Shift- 8+ hour shift, 5 days a week,

    Job Hazards

  • Chemical Handling
  • Personal Protective Equipment

    Physical Requirements

  • Must be able to lift at least 20lbs.
  • We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.

    This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

    Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy.

    The administrator will monitor compliance and is available to answer any questions on EEO matters.

    To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

    Keywords : Tiachung City Taichung City (TW-TXG) Taiwan (TW) Quality College Regular Engineering Not Applicable Tier 3

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