NPD Manager
Spring Professional
Taiwan
29天前

Responsibilities :

  • Fan-out & TSV evaluation, survey, and implement for future business.
  • proposal for solution build up by internal RD, license or OEM.
  • BKM survey and process flow define & control plan for wafer level package. (WLCSP, Fan-out & TSV)
  • Support to do revers engineering, revers engineering for competition analysis,and process integration of wafer level package. (WLCSP, Fan-out & TSV)
  • Direct material (PI / PBO / Plated Metal) benchmarking & suggestion for wafer level package.
  • Requirements :

  • More than 3 - 5 years of working experience in managing process engineering team.
  • Experienced in wafer level assembly, packaging, process integration, and project management.
  • Bachelor and above, major in Engineering and Material Science relevant degree.
  • Excellent interpersonal and communication skills both in English and Mandarin Chinese.
  • Familiar with P&L and ROI.
  • Please feel free to send your updated CV and contact info to Eric Chou if you're interested in this role, thank you.

    eric.chou springasia.com

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