Fan-out & TSV evaluation, survey, and implement for future business.
proposal for solution build up by internal RD, license or OEM.
BKM survey and process flow define & control plan for wafer level package. (WLCSP, Fan-out & TSV)
Support to do revers engineering, revers engineering for competition analysis,and process integration of wafer level package. (WLCSP, Fan-out & TSV)
Direct material (PI / PBO / Plated Metal) benchmarking & suggestion for wafer level package.
More than 3 - 5 years of working experience in managing process engineering team.
Experienced in wafer level assembly, packaging, process integration, and project management.
Bachelor and above, major in Engineering and Material Science relevant degree.
Excellent interpersonal and communication skills both in English and Mandarin Chinese.
Familiar with P&L and ROI.
Please feel free to send your updated CV and contact info to Eric Chou if you're interested in this role, thank you.