2018 International Recruitment
台灣積體電路製造股份有限公司
台灣
9天前

Description

1.2nm-5nm RD Engineer (Device, Integration, Module, Materials, MRAM)

2.Interconnect & Packaging RD Engineer

3.EUV Engineer, Lithography Engineer

4.12 Manufacturing Process / Integration Engineer

5.AI Chip Design Engineer

6.QR Engineer and many other technical and business positions

7.Managerial position of above domain

Qualifications

1.Technical Fields : Semiconductor Process Research & Development, Design Technology Platform, Manufacturing, Q&R, etc.

2.Professional Fields : IT, Business Development, Corporate Planning, Human Resources, Finance, Legal, etc.

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