Packaging Engineer Moen
Freescale
Kaohsiung
7天前

NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer.

As the world leader in secure connectivity solutions for embedded applications, we are driving innovation in the secure connected vehicle, end-

to-end security & privacy and smart connected solutions markets.

  • Assembly Front End Process development
  • o Plan and execute NTI / NPI assembly FE process development with progress control and management.

    o Analyze and reporting development results.

    o Work with team for design rule and global spec.

    o Team work with other function groups in different sites.

    o Sharing professional knowledge and experience to others.

    o Proactive attitude and be able to undertake stress.

    Requirements :

  • Bachelor or Master majored in Mechanical / Material Engineering, Physics, or equivalent
  • 3 5 years’ experience in wire bonding process development
  • Positive thinking / attitude; excellent teamwork with inspiration; potential of leadership; extrovert and creative, self-starter.
  • Fluent in English language both oral and written (TOEIC>
  • 700)

  • Knowledge in field of Semiconductors Assembly
  • Fundamental knowledge : DOE, SPC, FMEA, 8D, DMAIC approaches.
  • Show sense of urgency and delivers to commitment
  • Has engineering curiosity
  • NXPis an Equal Opportunity / Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and / or expression, marital status, status as a disabled veteran and / or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law.

    In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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